US Patent Issued to Micron Technology on March 31 for "Thermal management of GPU-HBM package by microchannel integrated substrate" (Idaho Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,692, issued on March 31, was assigned to Micron Technology Inc. (Boise, Idaho).

"Thermal management of GPU-HBM package by microchannel integrated substrate" was invented by Xiaopeng Qu (Boise, Idaho), Hyunsuk Chun (Boise, Idaho) and Eiichi Nakano (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. The semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dis...