US Patent Issued to Micron Technology on March 31 for "Apparatus including integrated segments and methods of manufacturing the same" (American, Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,719, issued on March 31, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus including integrated segments and methods of manufacturing the same" was invented by Wei Zhou (Boise, Idaho) and Chien Wen Huang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide war...