US Patent Issued to Micron Technology on March 3 for "Apparatus for TSV data output control in multiple core dies" (Japanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,459, issued on March 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus for TSV data output control in multiple core dies" was invented by Kiyoshi Nakai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure provide an apparatus comprising: a plurality of TSVs; a plurality of core dies stacked with one another; and an output control circuit. Each core die includes a data output circuit coupled to one or more TSVs to output read data. The data output circuit includes a data splitter to provide first and second complementary read data in parallel based on the read data, an output data latch to latch the f...