US Patent Issued to Micron Technology on March 17 for "Integrated assemblies, and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,651, issued on March 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies, and methods of forming integrated assemblies" was invented by Gordon A. Haller (Boise, Idaho), William R. Kueber (Boise, Idaho), Zachary D. Beaman (Boise, Idaho), Christopher G. Shea (Boise, Idaho) and Taehyun Kim (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include a method in which a first stack is formed to include a metal-containing first layer, a second layer over the first layer, and a metal-containing third layer over the second layer. A first opening is formed to extend through the second and third layers....