US Patent Issued to Micron Technology on June 30 for "Electronic devices comprising pillars extending through a semiconductor material and adjacent to a source implant region, and related electronic systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,327, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Electronic devices comprising pillars extending through a semiconductor material and adjacent to a source implant region, and related electronic systems and methods" was invented by Collin Howder (Boise, Idaho) and Alyssa N. Scarbrough (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic devices comprising a source stack comprising one or more conductive materials, a source implant region within a top portion of the source stack, a source contact adjacent to the source stack, sidewalls of the source contact vertically adjacent to the source implant reg...