US Patent Issued to Micron Technology on June 23 for "Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposers" (Idaho Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,988, issued on June 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposers" was invented by Kunal R. Parekh (Boise, Idaho), Bret K. Street (Meridian, Idaho), Terrence B. McDaniel (Boise, Idaho) and Jaekyu Song (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly comprises a package substrate including (i) an upper surface having a plurality of internal contacts, (ii) a lower surface having a plurality of external contacts coupled to the plurality of internal contacts, and (iii) a cavity extending into the package s...