US Patent Issued to Micron Technology on June 23 for "Microelectronic devices with increased grain size" (Idaho Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,617, issued on June 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices with increased grain size" was invented by Pengyuan Zheng (Boise, Idaho), Yongjun J. Hu (Boise, Idaho), Pavan Reddy Kumar Aella (Eagle, Idaho), David Ross Economy (Boise, Idaho), Brittany L. Kohoutek (Bosie, Idaho) and Amritesh Rai (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a microelectronic device includes forming conductive interconnect structures vertically extending through isolation material to conductive contact structures coupled to pillar structures, forming a metal silicide material on the interconnec...