US Patent Issued to Micron Technology on June 23 for "Connecting semiconductor dies through traces" (Idaho Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,990, issued on June 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Connecting semiconductor dies through traces" was invented by Terrence B. McDaniel (Boise, Idaho), Bret K. Street (Meridian, Idaho), Wei Zhou (Boise, Idaho), Kyle K. Kirby (Eagle, Idaho), Amy R. Griffin (Boise, Idaho), Thiagarajan Raman (Boise, Idaho) and Jaekyu Song (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "This document discloses techniques, apparatuses, and systems for connecting semiconductor dies through traces. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first dielectric layer...