US Patent Issued to Micron Technology on June 2 for "On-die temperature control for semiconductor die assemblies and associated systems and methods" (Taiwanese Inventor)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,356, issued on June 2, was assigned to Micron Technology Inc. (Boise, Idaho).

"On-die temperature control for semiconductor die assemblies and associated systems and methods" was invented by Bang-Ning Hsu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "On-die temperature control for semiconductor die assemblies, and associated systems and methods are disclosed. In an embodiment, a semiconductor device assembly includes first and second semiconductor dies directly bonded to each other. The semiconductor dies each includes conductive pads and resistive heating components in a dielectric layer, where the resistive heating components are...