US Patent Issued to Micron Technology on June 2 for "Integrated assemblies and methods forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,646,538, issued on June 2, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods forming integrated assemblies" was invented by Che-Chi Lee (Boise, Idaho), Terrence B. McDaniel (Boise, Idaho), Kehao Zhang (Boise, Idaho), Albert P. Chan (Boise, Idaho), Clement Jacob (Boise, Idaho), Luca Fumagalli (Boise, Idaho) and Vinay Nair (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal sil...