US Patent Issued to Micron Technology on June 16 for "Microelectronic devices, and related methods of forming microelectronic devices" (Idaho Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,154, issued on June 16, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices, and related methods of forming microelectronic devices" was invented by Si-Woo Lee (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device comprises vertical stacks of memory cells, each of the vertical stacks of memory cells comprising a vertical stack of access devices, a vertical stack of capacitors horizontally neighboring the vertical stack of access devices, and a conductive pillar structure in contact with the vertical stack of access devices. The microelectronic device further comprises transistor structures ...