US Patent Issued to Micron Technology on July 7 for "Interfaces between higher voltage and lower voltage wafers and related apparatuses and methods" (Idaho, California Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,676,194, issued on July 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Interfaces between higher voltage and lower voltage wafers and related apparatuses and methods" was invented by Michael A. Smith (Boise, Idaho), Kunal R. Parekh (Boise, Idaho) and Hernan A. Castro (Shingle Springs, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interfaces between higher voltage and lower voltage wafers and related apparatuses and methods are disclosed. An apparatus includes a memory wafer and a logic wafer. Data storage elements of an array are configured to perform an operation responsive to an operational voltage potential. The memory wafer also i...