US Patent Issued to Micron Technology on July 14 for "Three-dimensional stacking semiconductor assemblies with near zero bond line thickness" (Idaho Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,233, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Three-dimensional stacking semiconductor assemblies with near zero bond line thickness" was invented by Owen R. Fay (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device package assemblies and associated methods are disclosed herein. In some embodiments, the semiconductor device package assembly includes (1) a base component having a front side and a back side opposite the first side, the base component having a first metallization structure at the front side, the first metallization structure being exposed in a contacting area at the front...