US Patent Issued to Micron Technology on Jan. 20 for "Hybrid bonding for semiconductor device assemblies" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,780, issued on Jan. 20, was assigned to Micron Technology Inc. (Boise, Idaho).

"Hybrid bonding for semiconductor device assemblies" was invented by Jyun Yang Wang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly including a first semiconductor die having a first dielectric region and a first bond pad that are disposed on a first side of the first semiconductor die; a second semiconductor die having a second dielectric region and a second bond pad that are disposed on a second side of the second semiconductor die; and a hybrid bonding interface between the first side of the first semiconductor die and t...