US Patent Issued to Micron Technology on Feb. 3 for "Separation method and assembly for chip-on-wafer processing" (Idaho Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,607, issued on Feb. 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Separation method and assembly for chip-on-wafer processing" was invented by Andrew M. Bayless (Boise, Idaho) and Bradley R. Bitz (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for separating semiconductor die stacks of a chip-on-wafer assembly is disclosed herein. In one example, divider walls are arranged in a pattern on a first surface of a device wafer such that regions between the divider walls define mounting sites. Die stacks are mounted to the device wafer, wherein individual die stacks are located at a corresponding mounting site between the...