US Patent Issued to Micron Technology on Feb. 24 for "Semiconductor die assemblies with decomposable materials and associated methods and systems" (Idaho Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,075, issued on Feb. 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor die assemblies with decomposable materials and associated methods and systems" was invented by Fatma Arzum Simsek-Ege (Boise, Idaho), Luoqi Li (Boise, Idaho) and Marsela Pontoh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attac...