US Patent Issued to Micron Technology on Feb. 24 for "Nested semiconductor assemblies and methods for making the same" (Singaporean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,096, issued on Feb. 24, was assigned to Micron Technology Inc. (Bosie, Indonesia).

"Nested semiconductor assemblies and methods for making the same" was invented by Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore), Hong Wan Ng (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The assembly includes an outer semiconductor device which has an active surface and a back surface. The back surface includes a cut that extends to a depth between the active surface and the back surface, and uncut regions on opposing sides of the cut. The assembly further includes an inn...