US Patent Issued to Micron Technology on Feb. 24 for "Heat spreader apparatus with magnetic attachments on printed wiring board assemblies, related methods and electronic systems" (Idaho Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,051, issued on Feb. 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Heat spreader apparatus with magnetic attachments on printed wiring board assemblies, related methods and electronic systems" was invented by Charles E. Siko (Boise, Idaho), Kaleb A. Wilson (Caldwell, Idaho) and Bradley R. Bitz (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the pr...