US Patent Issued to Micron Technology on Feb. 17 for "Methods and apparatus for using epoxy-based or ink-based spacer to support large die in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,679, issued on Feb. 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods and apparatus for using epoxy-based or ink-based spacer to support large die in semiconductor devices" was invented by Li Jao (Taichung, Taiwan), Min Hua Chung (Taichung, Taiwan) and Chong Leong Gan (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly includes a substrate and a first semiconductor device mounted to the substrate. An epoxy-based spacer is mounted to the substrate proximate to the first semiconductor device by an adhesive attached to a bottom surface of the epoxy-based spacer and to the substrate. A secon...