US Patent Issued to Micron Technology on Feb. 17 for "Input/output connections of wafer-on-wafer bonded memory and logic" (Idaho, Washington, California Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,625, issued on Feb. 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Input/output connections of wafer-on-wafer bonded memory and logic" was invented by Kunal R. Parekh (Boise, Idaho), Glen E. Hush (Boise, Idaho), Sean S. Eilert (Penryn, Calif.) and Aliasger T. Zaidy (Seattle).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer-on-wafer bonded memory and logic device can enable high bandwidth transmission of data directly between a memory die and a logic die. A memory device formed on a memory die can include many global input/output lines and many arrays of memory cells. Each array of memory cells can include respective local input/out...