US Patent Issued to Micron Technology on Dec. 23 for "Method of manufacturing microelectronic devices, related devices, systems, and apparatus" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,037, issued on Dec. 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Method of manufacturing microelectronic devices, related devices, systems, and apparatus" was invented by Chih Kai Wang (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method for stealth dicing a semiconductor wafer. The method may include implanting dopant ions to a first depth in the semiconductor wafer through a back side of the semiconductor wafer. The method may further include focusing a laser beam at an inside portion of the wafer through the back surface of the wafer to form a modified layer in material of the semiconductor wa...