US Patent Issued to Micron Technology on Dec. 2 for "Memory die interconnections to physical layer interfaces" (Idaho Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,948, issued on Dec. 2, was assigned to Micron Technology Inc. (Boise, Idaho).

"Memory die interconnections to physical layer interfaces" was invented by Yang Lu (Boise, Idaho) and Kang-Yong Kim (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure describes aspects of memory die interconnections to physical layer interfaces (PHYs) that may enable expanded channel bus width and improved signal integrity (SI). In aspects, a memory die is operably coupled to a first PHY via a command-and-address (CA) bus and data input/output (DQ) bus of the first PHY and to a second PHY via a chip select (CS) bus of the second PHY. The second PHY...