ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,407, issued on Dec. 2, was assigned to Micron Technology Inc. (Boise, Idaho).
"Liquid cooling manifold" was invented by Suresh Reddy Yarragunta (Bangalore, India), Deepu Narasimiah Subhash (Bangalore, India) and Ravi Kumar Kollipara (Telangana, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes a liquid cooling manifold cooling a processor component of a system by liquid cooling a first cold plate coupled to the processor component, cooling a memory component of the system by liquid cooling the first cold plate coupled to the memory component, and a liquid cooling a drive component of the system by liquid cooling a second cold pla...