US Patent Issued to Micron Technology on Dec. 16 for "Capacitor having electrodes formed within a substrate" (Singaporean, American Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,186, issued on Dec. 16, was assigned to Micron Technology Inc. (Boise, Idaho).

"Capacitor having electrodes formed within a substrate" was invented by Wen Wei Lum (Singapore), Kelvin Aik Boo Tan (Singapore) and Alaa N. Ali (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to various apparatuses and integrated assemblies. In some implementations, an apparatus may include a substrate having a first surface and a second surface that is on an opposite side of the substrate with respect to the first surface. The apparatus may include an integrated circuit disposed on the substrate. The apparatus may ...