US Patent Issued to Micron Technology on Aug. 4 for "Composite dielectric structures for semiconductor die assemblies and associated systems and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,069, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Composite dielectric structures for semiconductor die assemblies and associated systems and methods" was invented by Hung Cheng Chen (Taichung, Taiwan), Yu Chun Chen (Taichung, Taiwan) and Hsuan Chao Hou (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly...