US Patent Issued to Micron Technology on Aug. 25 for "Semiconductor device having die ring conductor" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,174, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device having die ring conductor" was invented by Teppei Miyaji (Sagamihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus that includes first and second circuit blocks integrated on a semiconductor chip, and a die ring conductor provided along edges of the semiconductor chip so as to surround the first and second circuit blocks. The first circuit block includes a first die ring controller. The second circuit block includes a second die ring controller. One of the first and second die ring controllers is coupled to the die ring conductor...