US Patent Issued to Micron Technology on Aug. 25 for "Intra-package memory die communication structures" (California Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,718,865, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Intra-package memory die communication structures" was invented by Hari Giduturi (Folsom, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged memory device can include a primary memory die coupled to a shared intra-package communication bus and coupled to an external host device using a host interface bus, and the host interface bus can include a host clock channel. The memory device can include multiple secondary dies coupled to the intra-package communication bus, and each of the secondary dies can be configured to receive the same messages from the primar...