US Patent Issued to Micron Technology on April 14 for "Apparatus comprising a metal portion in the top portion of capacitor structure, and related methods" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,458, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus comprising a metal portion in the top portion of capacitor structure, and related methods" was invented by Harutaka Honda (Hiroshima, Japan), Shogo Omiya (Hiroshima, Japan), Shoko Norifusa (Hiroshima, Japan) and Hidekazu Nobuto (Hiroshima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes: a plurality of capacitors each including first and second conductive portions and a dielectric portion therebetween; a first conductive structure containing the plurality of capacitors therein, and electrically coupled to the second conductive porti...