US Patent Issued to Microchip Technology on Oct. 6 for "Physics package for chip scale atomic clocks and method of making same" (Massachusetts Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,516, issued on Oct. 6, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Physics package for chip scale atomic clocks and method of making same" was invented by Ali Darvishian (Lynn, Mass.) and Peter Cash (Lynnfield, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A physics package for chip scale atomic clocks is provided. The physics package may include a first Low-Temperature Co-fired Ceramic (LCC) pad, a first suspension coupled to the first LCC pad, a core coupled to the first suspension, a second suspension coupled to the core and coupled to the first suspension to encapsulate the core, and a second LCC pad coupled to the second...