US Patent Issued to Microchip Technology on Dec. 30 for "Low-profile sealed surface-mount package" (New Hampshire, Massachusetts, Colorado Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,379, issued on Dec. 30, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Low-profile sealed surface-mount package" was invented by Saeed Shafiyan-Rad (Nashua, N.H.), Evan Kirk (Salisbury, Mass.), David Doiron (Ashburnham, Mass.), Christopher Alan Barnes (Arvada, Colo.) and Cliff Firth (Nashua, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein...