US Patent Issued to Micraft System Plus on April 14 for "Device configured to bond an electronic component, method for bonding an electronic component, and method for manufacturing a light-emitting diode display" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,573, issued on April 14, was assigned to Micraft System Plus Co. Ltd. (Taoyuan City, Taiwan).

"Device configured to bond an electronic component, method for bonding an electronic component, and method for manufacturing a light-emitting diode display" was invented by Chingju Lin (Taoyuan City, Taiwan), Sheng-Che Huang (Taoyuan City, Taiwan) and Shao-Wei Huang (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device configured to bond an electronic component includes a carrying platform, a pressing element, a closed space generating mechanism, a gas extracting mechanism, and an energy generating mechanism. The carrying platform i...