US Patent Issued to Meta Platforms Technologies on Nov. 18 for "Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices" (Washington, Colorado Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,659, issued on Nov. 18, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices" was invented by Cameron Elliot Glasscock (Redmond, Wash.), Zhenzhen Shen (Kirkland, Wash.), Felippe Jose Pavinatto (Lynnwood, Wash.), Omar Awartani (Redmond, Wash.), Allison Tuuri (Seattle), Lichuan Chen (Kirkland, Wash.), Aleksey Reiderman (Erie, Colo.) and Marcos Antonio Santana Andrade Jr. (Seattle).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic...