US Patent Issued to Merit Medical Systems on Sept. 15 for "Molded sensor assembly" (American, Swiss Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,411, issued on Sept. 15, was assigned to Merit Medical Systems Inc. (South Jordan, Utah).

"Molded sensor assembly" was invented by Rick Russell (Cottonwood Heights, Utah), Jonathan Cheney (West Jordan, Utah), Scott Brown (Riverton, Utah), Luca Salmaso (Ango, Switzerland) and Aaron Hopkinson (Herriman, Utah).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded sensor assembly for measuring parameters in a given circumstance. The molded sensor assembly includes a housing with one or more apertures that extends from an upper surface to a lower surface of the housing. A lower surface of the housing is coupled to an upper surface of a printed circuit ...