US Patent Issued to Mellanox Technologies on Dec. 2 for "C2C yield and performance optimization in a die stacking platform" (Israeli Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,085, issued on Dec. 2, was assigned to Mellanox Technologies Ltd. (Yokneam, Israel).

"C2C yield and performance optimization in a die stacking platform" was invented by Igal Kushnir (Hod Hasharon, Israel) and Ayal Eshkoli (Kiryat Tivon, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "Technologies for chip-to-chip (C2C) yield and performance optimization in a die stacking platform are described. One apparatus includes a substrate, a first integrated circuit disposed on the substrate at a first location, a second integrated circuit disposed on the substrate at a second location, and a third integrated circuit disposed on the second integrated cir...