US Patent Issued to MediaTek on Nov. 3 for "Semiconductor package assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,868, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor package assembly" was invented by Shih-Yi Syu (Hsinchu City, Taiwan) and Wen-Chou Wu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly is provided. The semiconductor package assembly includes a fan-out package and a memory package stacked on the fan-out package. The fan-out package includes a first redistribution layer (RDL) structure, a first logic die, through via (TV) interconnects, and first conductive structures. The first logic die and the first conductive structures are in contact with the first RDL st...