US Patent Issued to MediaTek on May 13 for "Semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,679, issued on May 13, was assigned to MediaTek Inc. (Hsinchu, Taiwan).

"Semiconductor package structure" was invented by Yi-Jyun Lee (Hsinchu, Taiwan), Duen-Yi Ho (Hsinchu, Taiwan), Hsing-Chih Liu (Hsinchu, Taiwan) and Che-Hung Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electric...