US Patent Issued to MediaTek on March 24 for "Semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,522, issued on March 24, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor package structure" was invented by Yi-Lin Tsai (Hsinchu City, Taiwan), Kun-Ting Hung (Hsinchu City, Taiwan), Yin-Fa Chen (Hsinchu City, Taiwan), Chi-Yuan Chen (Hsinchu City, Taiwan) and Wen-Sung Hsu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a first redistribution layer, a second redistribution layer, a first semiconductor die, a second semiconductor die, an adhesive layer, and a molding material. The second redistribution layer is disposed over the first redistribution layer. The first s...