US Patent Issued to MediaTek on March 17 for "Semiconductor device with bridge die electrically connecting two chips and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,971, issued on March 17, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor device with bridge die electrically connecting two chips and manufacturing method thereof" was invented by Tai-Hao Peng (Hsinchu, Taiwan) and Yao-Tsung Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first layer structure, a second layer structure, a bridge die, a first SoC and a second SoC. The bridge die is disposed between the first layer structure and the second layer structure. The first SoC and the second SoC are disposed on the second layer structure. The first SoC and the second SoC are electr...