US Patent Issued to MediaTek on June 2 for "Cross-die interconnection monitor method and cross-die interconnection monitor system capable of extracting cross-die interconnection data for multi-die packages" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,645,620, issued on June 2, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Cross-die interconnection monitor method and cross-die interconnection monitor system capable of extracting cross-die interconnection data for multi-die packages" was invented by Po-Chao Tsao (Hsinchu City, Taiwan) and Tung-Hsing Lee (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cross-die interconnection monitor method includes providing a first die and a second die, embedding an intra-die detector into the first die for detecting a first feature of the first die, allocating a first inter-die detector from the first die to the second die for detecti...