ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,215, issued on Feb. 17, was assigned to MediaTek Inc. (Hsin-Chu, Taiwan).
"Semiconductor package using flip-chip technology" was invented by Che-Ya Chou (Kaohsiung, Taiwan), Wen-Sung Hsu (Hsin-Chu, Taiwan) and Nan-Cheng Chen (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrie...