US Patent Issued to MediaTek on Aug. 4 for "Semiconductor package with vapor chamber lid" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,005, issued on Aug. 4, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor package with vapor chamber lid" was invented by Chin-Lai Chen (Hsinchu City, Taiwan), Wei-Che Huang (Hsinchu City, Taiwan), Wen-Sung Hsu (Hsinchu City, Taiwan), Chun-Yin Lin (Hsinchu City, Taiwan), Li-Song Lin (Hsinchu City, Taiwan) and Tai-Yu Chen (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate having a top surface and a bottom surface. A semiconductor device is mounted on the top surface of the substrate. The semiconductor device has an active front surface directly facing the substrate, and a...