US Patent Issued to MediaTek on Aug. 4 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,000, issued on Aug. 4, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Yu-Jin Li (Hsinchu City, Taiwan), Bo-Jiun Yang (Hsinchu City, Taiwan), Tai-Yu Chen (Hsinchu City, Taiwan), Tsung-Yu Pan (Hsinchu City, Taiwan) and Chun-Yin Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component i...