US Patent Issued to MediaTek on April 14 for "Semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,766, issued on April 14, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor package structure" was invented by Hsiao-Yun Chen (Hsinchu City, Taiwan), Yao-Tsung Huang (Hsinchu City, Taiwan) and Cheng-Jyi Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second through via, a molding material, a second semiconductor die, and a second redistribution layer. The first semiconductor die is disposed over the first redistribution layer and includes a first through via having a first width. The second through via i...