US Patent Issued to MATSUMOTO YUSHI-SEIYAKU on Oct. 20 for "Heat-expandable microspheres, process for producing the same, and application thereof" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,477, issued on Oct. 20, was assigned to MATSUMOTO YUSHI-SEIYAKU Co. LTD. (Osaka, Japan).

"Heat-expandable microspheres, process for producing the same, and application thereof" was invented by Jun Takeuchi (Yao, Japan) and Tomohiro Yamauchi (Yao, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heat-expandable microspheres which have a blowing agent encapsulated efficiently therein so as to prevent the blowing agent from escaping out of the microspheres during storage at high temperature, a process for producing the same, and applications thereof. The process for producing heat-expandable microspheres containing a thermoplastic resin shell and a...