US Patent Issued to MACRONIX International on March 31 for "Semiconductor structure with enhances strength and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,450, issued on March 31, was assigned to MACRONIX International Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure with enhances strength and manufacturing method thereof" was invented by Chia-Tze Huang (Hsing-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a substrate, a stacked structure, a support pillar, and a channel pillar is provided. The substrate includes a peripheral region and an array region. The stacked structure is located on the substrate. The support pillar is located in the peripheral region. The support pillar passes through the stacked structure. The channel pillar is located in th...