ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,574, issued on March 24, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan).
"Compensation method for wafer bonding" was invented by Tien Chu Yang (Hsinchu City, Taiwan) and Chin Cheng Yang (Kaohsiung County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A compensation method for wafer bonding includes bonding a first wafer and a second wafer, the first wafer including a first conductive pad and a second conductive pad. A first overlay check is performed. A result of the first overlay check is determined whether the result is within a first predetermined specification. If the result of the first overlay check is determined as...