US Patent Issued to MACRONIX INTERNATIONAL on June 30 for "Three dimensional semiconductor device stack, system having the same, and method of operating three dimensional semiconductor device stack" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,295, issued on June 30, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan).

"Three dimensional semiconductor device stack, system having the same, and method of operating three dimensional semiconductor device stack" was invented by Cheng-Hsien Lu (Taoyuan City, Taiwan), Ming-Hsiu Lee (Hsinchu City, Taiwan), Dai-Ying Lee (Hsinchu County, Taiwan) and Teng-Hao Yeh (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three dimensional semiconductor device stack includes a first non-volatile memory array device, a second non-volatile memory array device, and a functional device. The first non-volatile memory array device ...