US Patent Issued to MACRONIX International on Dec. 16 for "Bonding structure, semiconductor chip and fabricating method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,143, issued on Dec. 16, was assigned to MACRONIX International Co. Ltd. (Hsinchu, Taiwan).

"Bonding structure, semiconductor chip and fabricating method thereof" was invented by Cheng-Hsien Lu (Taoyuan, Taiwan), Wei-Lun Weng (Tainan, Taiwan), Ming-Hsiu Lee (Hsinchu, Taiwan) and Dai-Ying Lee (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip including a semiconductor substrate and an interconnect structure is provided. The semiconductor substrate includes semiconductor devices. The interconnect structure is disposed on the semiconductor substrate and electrically connected to the semiconductor devices. The sem...