US Patent Issued to LX SEMICON on Oct. 27 for "Chip on film package including protective layer and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,715, issued on Oct. 27, was assigned to LX SEMICON Co. LTD. (Daejeon, South Korea).

"Chip on film package including protective layer and display device including the same" was invented by Min Ho Jeon (Daejeon, South Korea) and Dam Ha (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a chip on film package including a base film, output wiring disposed on the base film and extending along a first direction, an insulation layer overlapping at least a portion of the output wiring, an output pad portion defined as a region in which the output wiring is exposed without the insulation layer, a semiconductor chip mount...