US Patent Issued to LX SEMICON on March 31 for "Chip on film package and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,696, issued on March 31, was assigned to LX SEMICON Co. LTD. (Daejeon, South Korea).

"Chip on film package and display device including the same" was invented by Dam Ha (Daejeon, South Korea) and Kyung Hyun Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip on film package according to one embodiment of the present disclosure includes: a base film; a wiring unit located on the base film; a semiconductor chip mounted on the wiring unit; a first heat dissipation unit configured to come into contact with the semiconductor chip; a second heat dissipation unit configured to come into contact with the first heat dissipation u...